Specifications:
| Contact Material | Brass Gold plated |
| Insulator Material | PA9T/LCP |
| Contact Plating | Gold plated |
| Withstanding Voltage | 1000V AC/minute |
| Insulation Resistance | 1000MΩ Min |
| Package : | Reel packing/tube packing/ bag packing |
| soldering type | Straight |
| Max ProcessingTemperature: | -230 ℃ for 30~60S (260℃ for 10S) |
| Contace Resistance: | 20 MΩ Max |
| Packing Method: | Tray |
Company Information:
Company history:
In July,2004, Shenzhen Jinling Electronic CO., Ltd was established, the company focused on connector metal stamping mold R&D , manufacturing and plastic mold and assembly.
In June,2005 the company has passed the CQC certifications ISO9001:2008 and ISO14001:2004.
In 2007, the company registered the trademarks”JILN”and”NETECH”
In January,2008, the product of the company were rated as good quality products by Market Protection Committee of China’s Famous brand products.
In April,2008, The products of the company were rated as “Green Products” by international Green Management Committee.
Production Capability:
The factory with area of 20,000 square meters and has about the total number of employees 600 people and owns 30 sets precision mold processing equipment from Taiwan, 34 sets precision plastic injection machine from Taiwan& Japan, as well as 24 sets high –speed precision punch,
Complete Testing Equipment:
Certifications:
FAQ:
what is PCB connector development trend?
1. miniaturization
Small size, lightweight, small pitch, reduced height, high density / high pin count
High-frequency signal / transmission
Low contact resistance, low inductance effect, good signal shielding effect, signal delay, Crosstalk, etc.
2.Automation
Reduced station manufacturing process, Auto Pick & Place, SMT Type, improved product accuracy, and maintenance methods
Human interface
User-friendly and fool-proof design
3. Low cost of use
Product standardization, flexible product and process design, compression of delivery time
